基材(Substrate):聚酰亞胺/聚脂
基材厚度(Thickness of polyimide / polyester substrate):0.025mm---0.125mm
銅箔厚度(Copper foil thickness):0.009MM0.018mm 0.035mm 0.070mm 0.010mm
雙面壓延銅 可折疊性好、抗拉強(qiáng)度好,材料伸縮性較。 疊層分析:PI膜+膠+基材(線路銅+膠+PI基材+膠+線路銅)+膠+PI膜;
耐焊性:85---105℃/ 280℃---360℃
較小線寬線距(Minimum line width)0.075mm/0.075mm(3mil/3mil)
較小鉆孔孔徑(Minimum borehole diameter):0.15mm(6mil)
較小沖孔孔徑(Minimum punching aperture):φ0.50mm
較小覆蓋膜橋?qū)挘∕inimum coverage bridge width):0.30mm
鉆孔較小間距(Drilling minimum spacing):0.20mm
抗繞曲能力(Anti-winding ability):>15萬次
蝕刻公差(Etching tolerance):±0.25 mil
曝光對位公差:±0.05mm(2mil)
油墨類型:感光阻焊油,紫外光固化油,局部阻焊油+保護(hù)膜,可剝離阻焊油,碳漿,銀漿 油墨顏色:常用色有綠,黃,黑,白,其它色可以根據(jù)客戶需求調(diào)制
投影打孔公差:±0.025mm(1mil)
貼pi膜對位公差:<0.10mm(4mil)
貼補(bǔ)強(qiáng)及膠紙對位公差:<0.1mm(4mil)
表面鍍層工藝:環(huán)保RoHS,OSP舒緩反應(yīng),表面沉金處理;
外形加工工藝:鋼摸成型 成型公差:慢走絲模±0.05mm快走絲模具±0.1mm
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